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SiC BOULE GRINDER Q2 incl. flat

MACHINE DESCRIPTION

Revolutionary Outer Diameter Grinding Technology: Models Q2 and Q2+

Q2 - The Entry-Level Solution for Precision Grinding

Our Q2 model redefines outer diameter grinding technology. It is a semi-automated, high-precision machine specifically designed for processing hard and brittle materials such as SiC, sapphire, and others used in the semiconductor industry. The machine offers integrated flat and notch functions for workpieces with 6 and 8-inch diameters. Ideal for beginners and smaller production facilities, the Q2 sets new industry standards. However, the Q2+ can do even more.

Q2+ - Enhanced Capabilities and Highest Accuracy

The future Q2+, currently under development, expands our capabilities through features such as a new machine bed and an innovative notch unit that allows for post-processing of profile depth. With a line scanner for direct and fully automatic quality control, the Q2+ will enable even more precise processing. An integrated X-ray procedure can be added upon customer request. The machine control is intuitive and facilitates even complex grinding operations.

User-Friendliness and Technology

The Q2+ is characterized by intuitive, dialog-based control that allows for easy navigation and operation. Even complex grinding operations are simplified through a variety of available programs. The innovative grinding kinematics and the use of a specially manufactured grinding wheel instead of a conventional 1A1 grinding wheel significantly reduce control complexity, greatly simplifying the grinding process. This simplification helps minimize downtime and reliably achieve the desired annual throughput, according to the SEMI E10 standard.

Highest Precision through Advanced Technology

In our latest development, we can combine the X-ray process directly with the grinding machine at the customer's request to produce SiC boules with even more precise axis accuracy measurement. This integration allows us to directly compete with providers of so-called "All-in-1" grinding machines by countering with the Surface Grinder RCplus or Model T501evo, following our ALL-IN-2 principle. Our in-process monitoring technologies, including structure-borne sound sensors and advanced measurement technology, ensure that the processed workpieces are free of chipping and cracks and meet the highest quality standards.

Sustainability and Efficiency

Both models reduce electricity and water consumption by more than 50%, outperforming modified competitor products. Despite the enhancements, the installation space remains the same, offering a significant advantage for the manufacturing layout of chip producers.

Compact Design with Great Impact

The Q2 and Q2+ models are the world's smallest machines in their class with a footprint of just 2.56 m². This compact design allows three of our machines to be installed in the space of a single competitor machine. We are proud to announce that the Q2 model has won the Red Dot Design Award 2024.

All-in-1 vs. All-in-2: Flexibility and Reliability

Our flexible solution separates the two grinding applications in the boule production process, creating significant manufacturing redundancy. This modularity prevents total production failures that can occur in All-in-1 systems due to component failures, such as spindle damage. In such cases, the entire production process from boule to puck could temporarily come to a standstill, resulting in significant financial losses, especially considering the high investment costs of over 1.5 million EUR. Additionally, it does not require elaborate preparation of workpieces, which significantly increases flexibility and efficiency in the production process.

With the Q2 and Q2+, we are setting new standards in outer diameter grinding technology and offering our customers the highest quality, efficiency, and reliability.

Technical Data