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SiC BOULE GRINDER Q2 incl. flat


The Revolution in External Cylindrical Grinding Technology - Q2

Our specially designed Q2 External Cylindrical Grinding Machine is more than just a grinder; it's a fully automated, high-precision solution for processing SiC Boules in the semiconductor industry. With integrated Flat feature for workpieces with 6 and 8-inch diameters, the Q2 sets new standards.

User-Friendliness Meets Technology

The intuitive, dialogue-based control system of the Q2 allows for easy navigation and operation. Even complex grinding operations are simplified through multiple program selections.

Precision at its Finest

Based on prior X-ray measurements, the exact position for Flat is automatically and precisely determined and transferred into the Q2. In-process monitoring technologies such as acoustic emission sensors and measurement technology guarantee flawless workpieces without chipping and cracks.

Sustainability and Efficiency

The Q2 is an innovation from the ground up and surpasses modified competitor products in terms of efficiency. It reduces electricity and water consumption by more than 50%, thus offering significant cost savings.

Compact Design, Big Impact

With a compact footprint of only 2.56 m² (1.6 * 1.6m), the Q2 is the smallest machine of its kind worldwide. It allows for the installation of three Q2 machines in the space of one competitor machine.

Technical Specifications

  • External dimensions: approx. 1.6 * 1.6 * 1.9 m

  • Weight: approx. 4.5 tons

  • Electrical consumption: approx. 15 kW

  • Water consumption: 6,000 liters/year

Contact us for more information and experience the future of grinding technology.

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