2. Quarter 2010
Logomatic And G&N Developed Wafer Line to Save 20% Production Costs
German diamond wire saw producer Logomatic and german precision grinding machines producer G&N together developed a multi-crystalline wafer line to save for PV wafer 20% production costs. In a new technology and machine approach Logomatic and G&N have developed an optimized process and new machines to lower wafer production costs. “We raise the usable height of almost any ingot manufacturer and optimize productivity of squaring, polishgrinding and cropping steps by simple and effective means” says CEO Gerhard Koennemann and adds: “According to the experience so far with numerous global players 20% is not the end of our possibilities if a good ingot which was well crystallized is the base for further production into wafers. Often deciders lack technical understanding of the complete process chain. And as soon as we bring together all specialists and form a team we can discuss all benefits of modifications in the beginning which often result in higher productivity at the end. Then our customers are amazed and happy about new approaches to help and increase their sales.” Basic ideas in the approach of Logomatic and G&N are: First, the increase of the usable height of the ingots for wafers. Second, the reduction of mostly underestimated side costs as e. g. the use of diamond wire erases all costs for slurry management, extra personell, avoidable maintenance and repairs. Third, the use of small and highly effective machines like e. g. diamond wire squarers. Fourth, extra sales by higher usage of the numbers of usable wafers through ductile polishgrinding. The advantages go on like puzzle pieces but are reduced to the main points here to awaken an understanding for some obvious and critical issues in multi-si wafer production. Koennemann claims that even a 30% cost reduction is possible by simple means already at this very moment.
