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Slicing Brittle Materials in Service Contracting
µ-Chip Production practices a new technology to cut for its job shop business based on three modes of diamond wire cutting. “We cut all brittle material: Glass, quartz, rubber, tungsten, Wolfram wires in small bits with our unique diamond wire saw (made by german manufacturer Logomatic) and diamond wire with small kerf loss. The cut is absolutely free from any bath and high quantities of pieces can be cut very economically“, CEO Gerhard Koennemann says.
The standard contract job program of µ-Chip is to cut with diamond wire sapphire crystals and other brittle materials into wafers or cubes. Slicing solar wafers is becoming an increasingly interesting field for them, too.
