NEWS/PRESS

4. Quarter 2010
Logomatic Squaring With Diamond Wire Results in Lower COO

3. Quarter 2010
Logomatic Mono-Si Diamond Wire Squarer With Higher Productivity

2. Quarter 2010
Logomatic And G&N Developed Wafer Line to Save 20% Production Costs

1. Quarter 2010
50% Wafer Breakage Reduction By Ductile Polishgrinding

Slicing Brittle Materials in Service Contracting